Package antennas

A semiconductor package, comprising:

• a multi-layer substrate including multiple metal layers and a solid dielectric layer positioned between the multiple metal layers, the multi-layer substrate including first and second contacts coupled to the multiple metal layers;
• a semiconductor die having a device side in which circuitry is formed, the device side of the semiconductor die coupled to the first contact;
• an antenna vertically distanced from the multi-layer substrate and extending in a horizontal direction;
• a metal member extending from the antenna in the horizontal direction;
• a conductive member coupling the antenna to the second contact;
• and
• a mold compound contacting the multi-layer substrate, the semiconductor die, the antenna, the metal member, and the conductive member, the metal member exposed on one or more exterior lateral surfaces of the mold compound.

A method for manufacturing a semiconductor package, comprising:

• coupling a semiconductor die to a die pad of a first lead frame, the semiconductor die having a device side in which circuitry is formed, the first lead frame including a conductive terminal;
• coupling a bond wire to the device side of the semiconductor die and to the conductive terminal;
• positioning a second lead frame above the semiconductor die and the first lead frame, the second lead frame including an antenna and a conductive member;
• coupling a bent conductive member of the second lead frame to the conductive terminal;
• and
• applying a mold compound covering the semiconductor die, the bond wire, and the first and second lead frames, the conductive terminal exposed on an exterior lateral surface of the mold compound.