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AssigneeApplied Materials, Inc.
InventorsLei ZHANG, Xiaosong JI, Chen-Ying WU, Eric DAVEY, Borui XIA, Liurui LI, Renzhong DU, Kiran GARIKIPATI, Somanna MALLANGADA BOSE, Raghu Saraneesh ATMAKUR SUBRAMANYA, Jose RUIZ, Guru DUTT, Christophe MARCADAL
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Embodiments of the present disclosure generally relate to semiconductor processing equipment. In one or more embodiments, a processing system includes a plasma source assembly, an exhaust line operable to exhaust materials, a flow adapter, and a gas supply assembly fluidly connected to the flow adapter. The gas supply assembly includes a first gas source operable to flow a first composition, a first supply valve fluidly between the flow adapter and the first gas source, and a first diverter valve between the exhaust line and an upstream side of the first supply valve. The gas supply assembly includes a second gas source operable to flow a second composition, a second supply valve fluidly between the flow adapter and the second gas source, and a second diverter valve between the exhaust line and an upstream side of the second supply valve.
A processing system comprising:
A gas supply assembly, comprising:
A method of substrate processing, comprising:
Dependencies are inferred from the claim text.