Sample holder and method for manufacturing specimen using the same

A sample holder comprising:

• a substrate including a grid-accommodating region and a sample-accommodating region;
• a first grid coupling portion comprising:
• a first support on the grid-accommodating region, the first support protruding in a first direction from the substrate;
• and
• a second support on the grid-accommodating region and spaced apart from the first support in a second direction that is perpendicular to the first direction, the second support protruding in the first direction from the substrate;
• a second grid coupling portion including a groove defined within the substrate, the second grid coupling portion being on the grid-accommodating region and spaced apart from the first grid coupling portion in a third direction that is perpendicular to each of the first direction and the second direction;
• and
• a fixing module on the sample-accommodating region, the fixing module comprising a third support protruding in the first direction from the substrate, and an elastic assembly spaced apart from the third support in the second direction, the fixing module comprising an opening between the third support and the elastic assembly that is configured to receive a sample of a semiconductor device.

A sample holder comprising:

• a substrate including a grid-accommodating region and a sample-accommodating region;
• a first grid coupling portion comprising:
• a first support on the grid-accommodating region, the first support protruding in a first direction from the substrate;
• and
• a second support on the grid-accommodating region and spaced apart from the first support in a second direction that is perpendicular to the first direction, the second support protruding in the first direction from the substrate;
• a second grid coupling portion including a groove defined within the substrate, the second grid coupling portion on the grid-accommodating region and spaced apart from the first grid coupling portion in a third direction that is perpendicular to each of the first direction and the second direction;
• and
• a fixing module comprising:
• a third support on the sample-accommodating region, the third support protruding in the first direction from the substrate;
• and
• an elastic assembly spaced apart from the third support in the second direction, the fixing module comprising an opening between the third support and the elastic assembly that is configured to receive a sample of a semiconductor device;
• wherein the first support and the fixing module overlap each other in the second direction.