Thin film capacitor and circuit board having the same
AssigneeTDK Corporation
InventorsHitoshi SAITA, Rieki KAZAWA
Life of this patent
Estimating the term…
Loading patent…
AssigneeTDK Corporation
InventorsHitoshi SAITA, Rieki KAZAWA
Estimating the term…
Please replace the abstract with the following: To provide a thin film capacitor capable of reducing a connection resistance between a terminal electrode and a capacitance electrode. A thin film capacitor includes: unit capacitors to stacked to one another through an insulating layer; and via conductors. The unit capacitor includes: a capacitance electrode and a dummy electrode which are provided on one surface of a dielectric layer and a capacitance electrode and a dummy electrode which are provided on the other surface of the dielectric layer. The via conductor penetrates a stacked body so as to contact dummy electrodes, and capacitance electrodes. The via conductor penetrates the stacked body so as to contact dummy electrodes, and capacitance electrodes.
A thin film capacitor comprising:
Dependencies are inferred from the claim text.