Multilayer electronic component

A multilayer electronic component comprising:

• a body including:
• a capacitance formation portion including:
• a dielectric layer;
• and
• an internal electrode layer and a floating electrode layer alternately disposed in a thickness direction with the dielectric layer interposed therebetween;
• and
• a cover portion disposed on each of first and second surfaces of the capacitance formation portion in the thickness direction,
• the body including first and second surfaces opposing each other in the thickness direction, third and fourth surfaces connected to the first and second surfaces of the body and opposing each other in a length direction, and fifth and sixth surfaces connected to the first to fourth surfaces of the body and opposing each other in a width direction;
• a first external electrode including:
• a first connection portion disposed on the third surface of the body, and
• a first band portion extending from the first connection portion onto first portions of the first and second surfaces of the body;
• a second external electrode including:
• a second connection portion disposed on the fourth surface of the body, and
• a second band portion extending from the second connection portion onto second portions of the first and second surfaces of the body;
• and
• an insulating layer including silicon (Si) disposed on the body,
• wherein a ratio (AV/BL) of a voltage AV applied to the multilayer electronic component to a length BL between the first and second band portions satisfies 0.5 V/μm≤AV/BL≤1.2 V/μm.