Device security shield structure
AssigneeCONNECTEC JAPAN Corporation
InventorsMamoru ANDO, Yasuhiko KUTSUZAWA, Hidekazu MACHIDA
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Abstract
A device security shield structure wherein a security wiring structure 4, comprising wiring 3 or the like and having a unique characteristic, is provided on an upper portion of a device 2 on a substrate 1, and this wiring structure 4 is covered with a synthetic resin 5, creating a configuration where it cannot be removed or be subject to external operational analysis measurement unless the wiring structure 4 is damaged. The acquisition of said unique characteristic is made an operating condition of the device 2, whereby if the wiring structure 4 is damaged or removed, the device 2 does not operate and operational analysis becomes impossible.
Claims6
A substrate-mounted device provided with a device security shield by a wiring structure, the substrate-mounted device comprising:
- a security wiring structure provided on an upper portion of a device mounted on a substrate, the security wiring structure outputting a unique characteristic to the device by means of wiring connected to the device or by wired passive elements or active elements,
- wherein the device and the wiring structure are covered with an opaque synthetic resin;
- the wiring structure is configured such that a wiring position of the wiring or a placement position of the passive elements or the active elements of the wiring structure is not visually recognizable from an outside by the covering opaque synthetic resin,
- the wiring structure comprises the wiring, which is circuitously wired vertically and horizontally on the upper portion of the device and wired in a wavy shape so as to have vertical unevenness, or comprises the passive elements or the active elements wired with the circuitously and wavily wired wiring, and is configured to output the unique characteristic to the device and is integrated with the device by being covered with the opaque synthetic resin,
- the wiring is configured to be damaged if the device is removed from the substrate, and the wiring is configured to be damaged by a measurement probe if the measurement probe is inserted from an outside to perform an operational analysis measurement of the device,
- wherein the wiring structure is configured such that the unique characteristic comprises a signal output from between predetermined terminals selected from a multitude of terminals of the wiring or the passive elements or the active elements, or comprises a combination of signals output from between different terminals,
- an acquisition by the device of the unique characteristic of the wiring structure, or an acquisition by the device of a combination of the unique characteristic of the wiring structure and a characteristic of the device, becomes an operating key for an acquisition of operating signal information or for an acquisition of circuit wiring information, and thereby becomes an operating condition of the device, and
- a device security shield by the wiring structure is provided that has a security function whereby, if the wiring structure is damaged or removed, the device cannot acquire the operating key for the acquisition of the operating signal information or the acquisition of the circuit wiring information and cannot operate, thereby making operational analysis of the device impossible.
(canceled)
Dependencies are inferred from the claim text.