Processor with Inter-Die Interfaces and Scale-Up Fabric Interfaces including UALink and CXL

A method of manufacturing a processor derived from an established CPU design, the method comprising:

• fabricating circuitry for memory channels capable of communicating with memory located outside the processor;
• fabricating circuitry for processing cores coupled via a coherent interconnect, wherein the processing cores are configured to utilize physical addresses within a first physical address space to access the memory via the memory channels, and to respond to snoop requests that include physical addresses within the first physical address space;
• fabricating circuitry for communication ports selected from at least one of:
• Compute Express Link (CXL) endpoints, CXL switch ports, or UALink ports;
• wherein the communication ports are configured to receive messages comprising physical addresses within other physical address spaces;
• fabricating circuitry for a resource provisioning unit (RPU) configured to translate physical addresses within the other physical address spaces to physical addresses within the first physical address space;
• and
• fabricating termination circuits at interfaces connecting between:
• a first silicon die area comprising the communication ports, and a second silicon die area that does not include the communication ports.