Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium
AssigneeKokusai Electric Corporation
InventorsSusumu NISHIURA, Kenichi MAEDA, Hiroyuki KITAMOTO, Hajime ABIKO
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AssigneeKokusai Electric Corporation
InventorsSusumu NISHIURA, Kenichi MAEDA, Hiroyuki KITAMOTO, Hajime ABIKO
Estimating the term…
There is provided a configuration that includes: at least one transfer mechanism configured to transfer a substrate and at least one processing mechanism configured to process the substrate; an earthquake detector configured to detect an earthquake; and a controller configured to control the at least one transfer mechanism and the at least one processing mechanism according to a detection result of the earthquake detector, wherein the controller is configured to be capable of performing a stopping operation of the at least one transfer mechanism according to a P wave (initial tremor wave) and an S wave (principal fluctuation wave).
A method of manufacturing a semiconductor device, comprising:
A substrate processing apparatus comprising:
A non-transitory computer-readable recording medium storing a program that causes a controller to perform a process, wherein the program is executed in a substrate processing apparatus including at least one processing mechanism that processes a substrate, the controller that receives a signal of at least one selected from the group of a P wave (initial tremor wave) and an S wave (principal fluctuation wave) of an earthquake by an earthquake detector, and that is capable of controlling the at least one processing mechanism according to the received signal, the process comprising:
Dependencies are inferred from the claim text.