Chemical-resistant protective film

Abstract

A protective-film forming composition that can form a protective film having excellent resistance to a semiconductor wet etching solution, that enables dry etching at a high etching speed to achieve a high etch rate (ER), and that can also be effectively used as a resist underlayer-film forming composition. The protective-film forming composition against the semiconductor wet etching solution contains (A) a compound or polymer having an epoxy structure represented by the following Formula (I), (B) a compound having a thiol structure, and (C) a solvent, in Formula (I), * represents a binding site; n represents 1 or 2; and when n=1, X represents an ether bond, an ester bond, or an amide bond, and when n=2, X represents a nitrogen atom or an amide bond.

Dependencies are inferred from the claim text.