Semiconductor chip-manufacturing protective film-forming composition, semiconductor substrate, semiconductor chip, and method for manufacturing semiconductor chip

Abstract

A semiconductor chip-manufacturing protective film-forming composition capable of forming a semiconductor chip-manufacturing protective film to be disposed on a semiconductor chip in order to provide a semiconductor chip with a protective film capable of protecting a semiconductor chip from damage accompanying transportation when an individual semiconductor chip obtained by dicing a semiconductor substrate is transported. A semiconductor chip-manufacturing protective film-forming composition for preventing damage to a circuit surface or a back surface of a semiconductor substrate or a semiconductor chip, the semiconductor chip-manufacturing protective film-forming composition containing a polymer and a solvent, wherein the polymer is selected from a phenolic hydroxy group-containing polymer and a carboxy group-containing polymer.

Dependencies are inferred from the claim text.