Substrate processing method, substrate processing apparatus, and method for manufacturing original plate
OwnerTakeharu MOTOKAWA, Noriko SAKURAI +1inventors
InventorsTakeharu MOTOKAWA, Noriko SAKURAI, Hideaki SAKURAI
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Abstract
A substrate processing method for processing a substrate having a pattern on which protrusions are formed includes forming a film containing carbon as a principal component on the substrate having the pattern on which the protrusions are formed, adjusting stress in the film, and removing the film and the protrusions after adjusting the stress in the film.
Claims18
A substrate processing method for processing a substrate having a pattern on which protrusions are formed, the method comprising:
- forming a film containing carbon as a principal component on the substrate having the pattern on which the protrusions are formed;
- adjusting stress in the film;
- and
- removing the film and the protrusions after adjusting the stress in the film.
A substrate processing apparatus comprising:
- a film forming chamber in which a film is formed on a workpiece;
- a stress adjustment chamber stress in the film is adjusted;
- a removal chamber in which the film is removed;
- and
- a conveyance chamber including a transfer device that is capable of conveying the workpiece,
- wherein the transfer device is configured to convey the workpiece to the film forming chamber, convey the workpiece to the stress adjustment chamber after the workpiece is conveyed to the film forming chamber, and convey the workpiece to the removal chamber after the workpiece is conveyed to the stress adjustment chamber.
A method for manufacturing an original plate, the method comprising:
- forming a film containing carbon as a principal component on protrusions that are formed on the original plate;
- adjusting stress in the film;
- and
- removing the film and the protrusions after adjusting the stress in the film.
Dependencies are inferred from the claim text.