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US 2026/0227680 A1Published application
Cooling device and electronic apparatus system
AssigneeFUJIFILM Corporation
InventorsYuta WATANABE, Yoshihiro HAYASHI, Nobuaki SUZUKI, Kouhei AWAZU
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Abstract
There is provided a cooling device including: a heat sink on which a plurality of fins for heat radiation are formed; and an attachment mechanism for attachably and detachably attaching the heat sink to an outer surface of an electronic apparatus, at least a part of the attachment mechanism overlapping a formation region of the fins.
Claims17
A cooling device comprising:
- a heat sink on which a plurality of fins for heat radiation are formed;
- and
- an attachment mechanism for attachably and detachably attaching the heat sink to an outer surface of an electronic apparatus, at least a part of the attachment mechanism overlapping a formation region of the fins,
- wherein the attachment mechanism includes
- an insertion hole provided in the formation region,
- an insertion portion to be inserted into the insertion hole, and
- an operation portion that is provided at one end of the insertion portion and is operated by a user in a case of attaching and detaching the heat sink.
4 more elements
Dependencies are inferred from the claim text.