Integrated circuit device facilitating same-side optical and electrical testing
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsXin-Hua Huang, Kuo-Hao Lee, Jung-Kuo Tu, Kejun Xia, Tse-En Chang
Life of this patent
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Abstract
Some embodiments relate to an integrated circuit (IC) device that includes a lens layer having an optical lens, an electrical IC die under the lens layer, a dielectric structure under the electrical IC die, and a substrate under the dielectric structure. A reflector is disposed at a top surface of the dielectric structure. An inverse grating coupler, a grating coupler, and an optical detector component are disposed on an upper surface of the substrate. One or more contacts are under the substrate. The one or more contacts are laterally offset from the inverse grating coupler and the grating coupler.
Claims20
An integrated circuit (IC) device, comprising:
- a lens layer comprising an optical lens;
- an electrical IC die under the lens layer;
- a dielectric structure under the electrical IC die;
- a reflector disposed at a top surface of the dielectric structure;
- a substrate under the dielectric structure;
- an inverse grating coupler, a grating coupler, and an optical detector component disposed on an upper surface of the substrate;
- and
- one or more contacts under the substrate, wherein the one or more contacts are laterally offset from the inverse grating coupler and the grating coupler.
An integrated circuit (IC) device, comprising:
- a first substrate comprising an optical lens on an upper surface of the first substrate;
- an electrical IC structure disposed under the first substrate;
- and
- a photonic IC structure disposed under the electrical IC structure, the photonic IC structure comprising:
- a second substrate;
- an optical detector component, a grating coupler, and an inverse grating coupler arranged over the second substrate;
- a reflector arranged over the inverse grating coupler;
- and
- wherein the grating coupler underlies the optical lens, and wherein the grating coupler and the inverse grating coupler are optically coupled to the optical detector component.
A method for forming an integrated circuit (IC) device, comprising:
- forming a grating coupler, an inverse grating coupler, and an optical detector component over a top surface of a substrate;
- forming a dielectric structure over the substrate;
- forming a reflector and a plurality of conductive structures in the dielectric structure;
- forming an electrical IC structure over the dielectric structure;
- and
- bonding a lens structure to the electrical IC structure, wherein the lens structure comprises an optical lens.
Dependencies are inferred from the claim text.