Optoelectronic package
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsJr-Wei LIN, Mei-Ju LU
Life of this patent
Estimating the term…
Abstract
An optoelectronic package is provided. The optoelectronic package includes a photonic component, a connection structure, and an electronic component. The photonic component has an active surface. The connection structure is in contact with the active surface of the photonic component. The electronic component is embedded in the connection structure. The connection structure includes a first redistribution structure in contact with the active surface of the photonic component.
Claims3
An optoelectronic package, comprising:
- a photonic component comprising a waveguide;
- a die having a first surface facing the photonic component and a second surface opposite to the first surface;
- a first redistribution structure between the first surface of the die and the photonic component;
- a second redistribution structure having a first surface and a second surface opposite to the first surface, wherein the first surface of the second redistribution structure is in contact with the second surface of the die;
- an encapsulant between the first redistribution structure and the second redistribution structure and encapsulating the die;
- a conductive pillar penetrating the encapsulant;
- and
- a printed circuit board on the second surface of the second redistribution structure,
- wherein the printed circuit board is electrically connected to the photonic component through the second redistribution structure, the conductive pillar, and the first redistribution structure in sequence.
An optoelectronic package, comprising:
- a photonic component;
- a first redistribution structure disposed over a first portion of the photonic component;
- a die disposed over the first redistribution structure;
- an encapsulant disposed over the photonic component and encapsulating first redistribution structure and the die, wherein the encapsulant defines a recess exposing a grating coupler of the photonic component;
- a second redistribution structure disposed over the encapsulant and electrically connected to the die;
- and
- a collimator element disposed within the recess of the encapsulant.
A method of manufacturing an optoelectronic package, comprising:
- providing a photonic component, wherein the photonic component defines a recess exposing a waveguide;
- disposing a die and a dummy die over the photonic component, wherein the recess is covered by the dummy die;
- forming an encapsulant encapsulating the die and dummy die;
- forming a redistribution structure over the encapsulant;
- and
- removing the dummy die to expose the recess of the photonic component.
Dependencies are inferred from the claim text.