Prober and probe inspection method

A probe inspection method in a prober including:

• a probe card including a plurality of measurement parts, each of the measurement parts having a wafer chuck having a holding surface configured to hold a wafer and a plurality of probes on a surface facing the holding surface;
• and
• an alignment apparatus configured to be movable between the measurement parts and detachably support the wafer chuck at a measurement part as a movement destination to perform relative alignment of the wafer chuck with respect to the probe card, wherein
• the alignment apparatus includes a probe position detection camera configured to detect tip positions of the probes at a position facing the probe card, and a tilting mechanism configured to tilt the wafer chuck, the probe inspection method comprising:
• a detection step of detecting a tilt angle of the probe card;
• and
• a tilt control step of controlling the tilting mechanism based on a detection result of the detection step to tilt the wafer chuck and the probe position detection camera integrally such that the holding surface is parallel to the probe card.