Stress and strain detection across a substrate of a semiconductor system using a photoelastic material

Abstract

Methods, systems, and devices for stress and strain detection across a substrate of a semiconductor system using a photoelastic material are described. In some examples, a semiconductor system may include a memory module having at least one segment of a photoelastic material over and/or on a substrate of the memory module. In some examples, the segment is located proximate an area of the substrate that is subject to a stress and/or strain condition during insertion of the memory module (e.g., an edge connector of the memory module) into a socket. The photoelastic material may be configured improve detection and/or monitoring of stresses on the memory module.

Dependencies are inferred from the claim text.