Equipment for predicting wafer deformation
AssigneeSamsung Electronics Co., Ltd.
InventorsSangyoung SEO, Jinkook PARK, Woncheol LEE, Young-Seok KIM, Youngil KIM, Chunghun PARK
Life of this patent
Estimating the term…
Abstract
An equipment for predicting wafer deformation includes a transport unit that transports a wafer; a sensor unit that recognizes a plurality of edge points of the wafer being transported by the transport unit; and a control unit that projects positions of the plurality of edge points of the wafer recognized by the sensor unit onto a coordinate plane, and predicts a plane form of the wafer based on the positions of the plurality of edge points of the wafer projected onto the coordinate plane.
Claims20
An equipment for predicting wafer deformation, the equipment comprising:
- a transport unit that transports a wafer;
- a sensor unit that recognizes a plurality of edge points of the wafer being transported by the transport unit;
- and
- a control unit that projects positions of the plurality of edge points of the wafer recognized by the sensor unit onto a coordinate plane, and predicts a plane form of the wafer based on the positions of the plurality of edge points of the wafer projected onto the coordinate plane.
An equipment for predicting wafer deformation, the equipment comprising:
- a transport unit that transports a wafer to a process chamber and returns the wafer discharged from the process chamber;
- a sensor unit that recognizes a plurality of pre-process edge points of the wafer during transport of the wafer by the transport unit and a plurality of post-process edge points of the wafer during return of the wafer by the transport unit;
- and
- a control unit that projects positions of the plurality of pre-process edge points of the wafer recognized by the sensor unit onto a coordinate plane and predicts a pre-process plane form of the wafer based on the positions of the plurality of pre-process edge points of the wafer projected onto the coordinate plane, and projects positions of the plurality of post-process edge points of the wafer recognized by the sensor unit onto the coordinate plane and predicts a post-process plane form of the wafer based on the positions of the plurality of post-process edge points of the wafer projected onto the coordinate plane.
An equipment for predicting wafer deformation, the equipment comprising:
- a transport unit that moves a wafer in a first direction, moves the wafer in a second direction opposite to the first direction, and then transports the wafer in the first direction;
- a sensor unit that recognizes a plurality of first edge points of the wafer during the wafer is moved in the first direction by the transport unit, and recognizes a plurality of second edge points of the wafer during the wafer is moved in the second direction by the transport unit;
- and
- a control unit that projects positions of the plurality of first edge points of the wafer and the plurality of second edge points of the wafer recognized by the sensor unit onto a coordinate plane, and predicts a plane form of the wafer based on the positions of the plurality of first edge points of the wafer and the plurality of second edge points of the wafer projected onto the coordinate plane;
- wherein the wafer passes through the sensor unit during moving in the first direction by the transport unit and during moving in the second direction by the transport unit.
Dependencies are inferred from the claim text.