Method for determining displacement maps, method for adjusting parameters for a bonding process, and composite substrate produced using said parameters, and system for producing a composite substrate

A method for providing a displacement map (6), comprising,

• providing a first substrate (1) and a second substrate (2),
• measuring the first substrate (1) to determine at least a first geometrical parameter and/or a microscopic first geometrical parameter, and the second substrate (2) to determine at least a second geometrical parameter,
• bonding the first substrate (1) to the second substrate (2) to form a composite substrate (4),
• measuring the bonded composite substrate (4) to determine at least one measured third geometrical parameter,
• providing at least one simulated third geometrical parameter for the bonded composite substrate (4) based on a composite model, wherein the simulated third geometrical parameter is provided as a function of the at least one first geometrical parameter, the at least one second geometrical parameter, and a preliminary displacement map (6′), indicating a local deviation from the desired ideal position, is simulated on the basis of the composite model by means of an analysis and/or simulation device (8), wherein the preliminary displacement map (6′) is created by means of the analysis and/or simulation device (8),
• comparing the at least one simulated third geometrical parameter with the at least one measured third geometrical parameter, and
• providing as a displacement map (6) that preliminary displacement map (6′) for which the deviation between the simulated third geometrical parameter and the at least one measured third geometrical parameter is minimal.