Silicone based resin composition, and semiconductor device comprising the same

A silicone-based resin composition, comprising:

• an organic polysiloxane;
• and
• a conductive filler, and
• wherein the conductive filler comprises a conductive powder that comprises flake-type particles having a thickness of 0.01 μm to 5 μm,
• wherein a relative ratio of a change in thermal conductivity to a change in Shore A hardness, measured by a measurement method below, of the silicone-based resin composition is 40% or less:
• [Measurement method]
• 1) The silicone-based resin composition is molded by hot press under conditions of 165° C. and a pressure of 26 kgf/cm2 for 15 minutes to manufacture a sheet.
• 2) The sheet is cured at 150° C. for 5 minutes to manufacture a first cured product. The first cured product is subjected to measurement of a Shore A hardness according to ASTM D-2240 and measurement of a thermal conductivity according to ISO 22007-2 at 25° C.
• 3) The first cured product is cured at 150° C. for 120 minutes to manufacture a second cured product. The second cured product is subjected to measurement of a Shore A hardness according to ASTM D-2240 and measurement of a thermal conductivity according to ISO 22007-2 at 25° C. temperature.
• 4) A relative ratio of a change in thermal conductivity to a change in Shore A hardness is calculated according to Equation 1 below:
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• (where H1 denotes the Shore A hardness of the first cured product, H2 denotes the Shore A hardness of the second cured product, TCH1 denotes a thermal conductivity (W/mK) in H1, and TCH2 denotes a thermal conductivity (W/mK) in H2).

A semiconductor device, comprising:

• a semiconductor package;
• a heat dissipation part disposed on the semiconductor package;
• and
• a heat conduction layer interposed between the semiconductor package and the heat dissipation part,
• wherein the heat conduction layer comprises a silicone-based resin composition,
• the silicone-based resin composition comprises organic polysiloxane and a conductive filler according to claim 1, and
• a relative ratio of a change in thermal conductivity to a change in Shore A hardness, measured by a measurement method below, of the silicone-based resin composition is 40% or less:
• [Measurement method]
• 1) The silicone-based resin composition is molded by hot press under conditions of 165° C. and a pressure of 26 kgf/cm2 for 15 minutes to manufacture a sheet.
• 2) The sheet is cured at 150° C. for 5 minutes to manufacture a first cured product. The first cured product is subjected to measurement of a Shore A hardness according to ASTM D-2240 and measurement of a thermal conductivity according to ISO 22007-2 at 25° C.
• 3) The first cured product is cured at 150° C. for 120 minutes to manufacture a second cured product. The second cured product is subjected to measurement of a Shore A hardness according to ASTM D-2240 and measurement of a thermal conductivity according to ISO 22007-2 at 25° C. temperature.
• 4) A relative ratio of a change in thermal conductivity to a change in Shore A hardness is calculated according to Equation 1 below:
• [
• (
• ❘
• "\[LeftBracketingBar]"
• TC
• H
• ⁢
• 2
• -
• TC
• H
• ⁢
• 1
• ❘
• "\[RightBracketingBar]"
• )
• /
• (
• H
• ⁢
• 2
• -
• H
• ⁢
• 1
• )
• ]
• ×
• 100
• [
• Equation
• ⁢
• 1
• ]
• (where H1 denotes the Shore A hardness of the first cured product, H2 denotes the Shore A hardness of the second cured product, TCH1 denotes a thermal conductivity (W/mK) in H1, and TCH2 denotes a thermal conductivity (W/mK) in H2).