Composition for hot melt adhesive, and method for producing layered product
AssigneeKaneka Corporation
InventorsDaichi YOKOTA, Hidenori TANAKA
Life of this patent
Estimating the term…
Abstract
An object is to provide a composition for a hot melt adhesive which composition contains a P3HA-based resin and has a low melt viscosity and an excellent elongation at break. The object is attained by a composition for a hot melt adhesive, containing a poly(3-hydroxyalkanoate)-based resin (A) in which a content of a poly(3-hydroxybutyrate) unit is not less than 50 mol % and a content of an amorphous hydroxyalkanoate unit is not less than 24 mol %.
Claims13
A composition for a hot melt adhesive, comprising a poly(3-hydroxyalkanoate)-based resin (A) in which a content of a poly(3-hydroxybutyrate) unit is not less than 50 mol % and a content of an amorphous hydroxyalkanoate unit is not less than 24 mol %.
Dependencies are inferred from the claim text.