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US 2026/0226253 A1Published application
Organic additives to reduce the coefficient of thermal expansion of polymer compositions
AssigneeNational Technology & Engineering Solutions of Sandia, LLC
InventorsErica M. Redline, Eric M. Nagel, Alex J. Commisso, Chad Staiger
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Abstract
In aspects, a polymer composition includes a thermoset or thermoplastic polymer and an additive comprising a thermally contractile heterocyclic organic molecule having a coefficient of thermal expansion (CTE) that is less than the CTE of the thermoset or thermoplastic polymer.
Claims27
A polymer composition comprising:
- a thermoset or thermoplastic polymer;
- and
- an additive comprising a molecule having a structure selected from the group consisting of:
- wherein R13 is selected from the group consisting of oxygen, nitrogen, and sulfur;
- wherein at least three of R1, R2, R3, and R4 are hydrogen;
- wherein at least three of R5, R6, R7, and R8 are hydrogen;
- and
- wherein the polymer composition has a coefficient of thermal expansion (CTE) that is less than a coefficient of thermal expansion of the thermoset or thermoplastic polymer.
5 more elements
A method of preparing a polymer composition comprising:
- blending a thermoset or thermoplastic polymer with an additive having a low or negative coefficient of thermal expansion (CTE), wherein the additive comprises a molecule having a structure selected from the group consisting of:
- wherein R13 is selected from the group consisting of oxygen, nitrogen, and sulfur;
- wherein at least three of R1, R2, R3, and R4 are hydrogen;
- and
- wherein at least three of R5, R6, R7, and R8 are hydrogen.
2 more elements
Dependencies are inferred from the claim text.