Thermal Printhead with Thermoelectric Cooling Module

A method of forming a thermal printhead assembly, comprising:

• providing a base unit comprising a printhead housing;
• installing, on the base unit, a circuit board defining a media facing side opposed to an anterior side, the circuit board comprising a plurality of heating elements disposed on the media facing side;
• and
• coupling, to the circuit board, a thermoelectric heat pump having a heat absorbing surface that is electrically coupled to a heat radiating surface, such that the heat absorbing surface is coupled to the anterior side of the circuit board.

A media processing device, comprising:

• a housing;
• a printhead assembly operatively coupled to the housing, the printhead assembly comprising:
• a printhead comprising:
• a circuit board defining a media facing side opposed to an anterior side, and
• a plurality of heating elements disposed on a media facing side of the circuit board, and
• a thermoelectric heat pump, having a heat absorbing surface and a heat radiating surface electrically coupled to each other, the heat absorbing surface coupled to the anterior side of the circuit board,
• wherein, in response to an electric signal flowing through the thermoelectric heat pump, the thermoelectric heat pump is configured to absorb heat emitted by the plurality of heating elements via the heat absorbing surface, and radiate the heat via the heat radiating surface;
• and
• a control system configured to control the electric signal.