Polyimide composite repair apparatus and method via high temperature resin transfer molding
AssigneeRtx Corporation
InventorsXiaomei Fang, Matthew Robert Zsunkan
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Abstract
An apparatus (50) for repairing a defective area in a polyimide composite (54) component includes a flexible film (56) enclosure for covering the defective area (52) of the polyimide composite component; a seal (62) around a perimeter of the film; a resin injection assembly (60) for injecting resin between the flexible film enclosure and the defective area of the component; and a vacuum source (58) for drawing vacuum between the flexible film enclosure and the component. A method is also disclosed.
Claims29
An apparatus for repairing a defective area in a polyimide composite component, comprising:
- a flexible film enclosure for covering the defective area of the polyimide composite component;
- a seal around a perimeter of the film;
- a resin injection assembly for injecting resin between the flexible film enclosure and the defective area of the component;
- and
- a vacuum source for drawing vacuum between the flexible film enclosure and the component.
A method for repairing a defective area of a polyimide composite component, comprising the steps of:
- establishing a resin transfer molding area around the defective area;
- and
- injecting resin above a melting temperature of the resin into the defective area.
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Dependencies are inferred from the claim text.