Systems and methods for laser drilling holes in a substrate

A system for drilling holes in a substrate, comprising:

• a laser;
• an xy scan head configured to position the laser in x and y dimensions relative to the substrate;
• a 3rd axis adjustment device configured to adjust a focal plane of the laser relative to a surface of the substrate in a z dimension;
• and
• a storage machine holding instructions executable by a logic machine to:
• focus the laser relative to the surface of the substrate at a first drilling location in the substrate;
• apply the laser to the surface of the substrate for a first drilling round comprising one or more drilling passes whereby the laser is moved in the x and y dimensions in a predetermined pattern;
• using the 3rd axis adjustment device, adjust the focal plane of the laser relative to the surface of the substrate in the z dimension;
• and
• apply the laser to the surface of the substrate at the first drilling location for a second drilling round comprising one or more drilling passes whereby the laser is moved in the x and y dimensions in the predetermined pattern.

A system for drilling holes in a carbon fiber reinforced polymer substrate, comprising:

• a picosecond pulsed green laser;
• an xy scan head configured to position the pulsed green laser in the x and y dimensions relative to the carbon fiber reinforced polymer substrate;
• a 3rd axis adjustment device configured to adjust a focal plane of the laser relative to a surface of the carbon fiber reinforced polymer substrate in a z dimension;
• and
• a storage machine holding instructions executable by a logic machine to:
• focus the laser relative to the surface of the carbon fiber reinforced polymer substrate at a first drilling location in the carbon fiber reinforced polymer substrate;
• apply the laser to the surface of the carbon fiber reinforced polymer substrate for a first drilling round comprising one or more drilling passes whereby the laser is moved in the x and y dimensions in a predetermined pattern;
• move the laser in the x and y dimensions to a second drilling location;
• apply the laser to the surface of the carbon fiber reinforced polymer substrate at the second drilling location for a subsequent drilling round comprising one or more drilling passes whereby the laser is moved in the x and y dimensions in the predetermined pattern;
• return the laser to the first drilling location;
• using the 3rd axis adjustment device, adjust the focal plane of the laser relative to the surface of the carbon fiber reinforced polymer substrate in the z dimension;
• following a duration wherein a temperature at the first drilling location decreases below a threshold temperature, apply the laser to the surface of the carbon fiber reinforced polymer substrate at the first drilling location for a second drilling round;
• move the laser in the x and y dimensions to the second drilling location;
• and
• apply the laser to the surface of the carbon fiber reinforced polymer substrate for an additional drilling round comprising one or more drilling passes whereby the laser is moved in the x and y dimensions in the predetermined pattern.