Integrating cooling channels into electrodes via advanced 3d printing techniques

An additive manufacturing method comprising:

• depositing an anode material to form an anode layer;
• depositing a thermally functional material to form a cooling layer including at least one embedded cooling channel being fluidly connectable to an inlet and an outlet and configured to transport a cooling medium;
• depositing a cathode material to form a cathode electrode,
• wherein the anode layer is deposited before or after the cathode layer is deposited;
• and
• laser sintering at least one of the anode layer, the cathode layer, and the cooling layer,
• wherein the thermally functional material comprises at least one of a thermally conductive material, a thermally insulating material, or a composite thereof, and is configured to dissipate heat generated by the anode layer and/or the cathode layer.

An energy storage device comprising:

• a first electrode layer formed of a first electrode material and having a first boundary defining a first surface area;
• a non-electrode layer positioned adjacent to the first electrode layer and having a second boundary that is coextensive with the first boundary, the non-electrode layer comprising a thermally functional material and at least one embedded cooling channel extending along a tortuous path across an area of the non-electrode layer, the at least one embedded cooling channel being fluidly connectable to an inlet and an outlet and configured to transport a cooling medium;
• a second electrode layer formed of a second electrode material and having a third boundary that is coextensive with the first boundary, the second electrode layer positioned on an opposite side of the non-electrode layer from the first electrode layer, wherein the first electrode layer is an anode layer and the second electrode layer is a cathode layer, or vice versa;
• one or more consolidated regions in at least one of the first electrode layer, the non-electrode layer, and the second electrode layer providing structural integrity and interlayer adhesion,
• wherein the thermally functional material of the non-electrode layer comprises at least one of a thermally conductive material, a thermally insulating material, or a composite thereof and is configured to dissipate heat generated by the first electrode layer and/or the second electrode layer, and
• wherein the at least one embedded cooling channel has a path length greater than a straight-line distance between its fluidic inlet and outlet.