Side of a die that is coplanar with a side of a molding

A package, comprising:

• an intermediate layer having a top side above a bottom side;
• a redistribution layer (RDL) over the top side of the intermediate layer;
• a first die coupled to the RDL by a first connection layer, the first die having a first plurality of through silicon vias (TSVs), and the first die having a first side and a second side, the second side laterally spaced apart from the first side;
• a second die coupled to the RDL by a second connection layer, the second die having a second plurality of TSVs, and the second die having a first side and a second side, the second side laterally spaced apart from the first side, wherein the first side of the second die is laterally spaced apart from the second side of the first die;
• a molding adjacent to the first side of the first die and adjacent to the second side of the second die, the molding extending down to the RDL;
• a third die coupled to a first portion of the first plurality of TSVs of the first die;
• a fourth die coupled to a second portion of the first plurality of TSVs of the first die, the fourth die laterally spaced apart from the third die;
• a fifth die coupled to a first portion of the second plurality of TSVs of the second die;
• and
• a sixth die coupled to a second portion of the second plurality of TSVs of the second die, the sixth die laterally spaced apart from the fifth die.

A method of fabricating a package, the method comprising:

• providing an intermediate layer having a top side above a bottom side;
• forming a layer comprising electrically conductive features over the top side of the intermediate layer;
• coupling a first mid-die to the layer comprising electrically conductive features by a first connection layer, the first mid-die having a first plurality of through silicon vias (TSVs), and the first mid-die having a first side and a second side, the second side laterally spaced apart from the first side;
• coupling a second mid-die to the layer comprising electrically conductive features by a second connection layer, the second mid-die having a second plurality of TSVs, and the second mid-die having a first side and a second side, the second side laterally spaced apart from the first side, wherein the first side of the second mid-die is laterally spaced apart from the second side of the first mid-die;
• forming a molding adjacent to the first side of the first mid-die and adjacent to the second side of the second mid-die, the molding extending down to the layer comprising electrically conductive features;
• coupling a first top die to a first portion of the first plurality of TSVs of the first mid-die;
• coupling a second top die to a second portion of the first plurality of TSVs of the first mid-die, the second top die laterally spaced apart from the first top die;
• coupling a third top die to a first portion of the second plurality of TSVs of the second mid-die;
• and
• coupling a fourth top die to a second portion of the second plurality of TSVs of the second mid-die, the fourth top die laterally spaced apart from the third top die.