Sealing resin and formation method thereof
AssigneeApic Yamada Corporation
InventorsMasaaki Wakui, Takashi Saito, Makoto Kawaguchi, Yudai Nomura
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Abstract
Provided are a sealing resin and a formation method thereof. The sealing resin includes: a plate-shaped or block-shaped main body part; and legs erected on one face of the main body part. The legs are softened or melted by heating during compression molding, and the main body part comes into contact with the workpiece.
Claims12
A sealing resin for compression molding of a workpiece, the sealing resin comprising:
- a plate-shaped or block-shaped main body part;
- and
- a leg erected on one face of the main body part,
- wherein the leg is softened or melted by heating during compression molding, and the main body part comes into contact with the workpiece.
(canceled)
A formation method for sealing resin for forming a sealing resin for compression molding of a workpiece having a configuration in which electronic components are mounted on a substrate, the method comprising:
- a formation step of forming into a shape having a plate-shaped or block-shaped main body part and a leg erected on the main body part,
- wherein the formation step includes a step of forming by setting a position and a height of the leg such that when the sealing resin is placed on the substrate, neither the leg nor the main body part contacts the electronic components, and a step of softening or melting the main body part and the leg by heating, and bringing the main body part into contact with the workpiece.
Dependencies are inferred from the claim text.