Semiconductor devices, methods of operating thereof, package structures, and systems

A semiconductor device, comprising:

• a first semiconductor structure and a second semiconductor structure;
• wherein the first semiconductor structure is bonded with a first side of the second semiconductor structure;
• wherein the first semiconductor structure includes an analog-to-digital conversion circuit;
• and
• wherein the second semiconductor structure comprises a plurality of sub-memory planes, a plurality of bit lines and a plurality of first connection structures, the plurality of sub-memory planes are located between the plurality of bit lines and the first side of the second semiconductor structure and arranged at intervals along an extending direction of the bit lines, and at least one of the first connection structures is located between two adjacent sub-memory planes and is respectively connected to the bit line and the analog-to-digital conversion circuit.

A method of operating a semiconductor device, comprising:

• performing a first operation on a plurality of sub-memory planes in a second semiconductor structure to obtain analog computing information;
• transmitting the analog computing information to an analog-to-digital conversion circuit in a first semiconductor structure through a plurality of bit lines and a plurality of first connection structures in the second semiconductor structure, wherein the first semiconductor structure is bonded with a first side of the second semiconductor structure, and at least one of the first connection structures is located between two adjacent sub-memory planes and respectively connected to the bit line and the analog-to-digital conversion circuit;
• and
• converting the analog computing information into digital information through the analog-to-digital conversion circuit.