Apparatus and method for bonding components and substrates

An apparatus (1) for bonding one or more components and one or more substrates (3), the apparatus comprising:

• a bonding station (5) for bonding the components to the substrates, wherein the components are to be bonded to the substrates at the bonding station;
• a transport device (7) for each time transporting the substrates along a trajectory (8) from one or more loading stations (4), via the bonding station, to one or more unloading stations (6), the transport device comprising:
• a carriage (11) having a flat support surface (12) for supporting the substrates thereon;
• a carriage moving device (13) for moving the carriage along the trajectory;
• and
• a downholding device (14) for holding the substrates on the support surface;
• one or more loading stations (4) for loading the substrates onto the carriage, comprising one or more pull-in devices (9) for pulling the substrates onto the support surface of the carriage;
• and
• one or more unloading stations (6) for unloading the substrates after the components have been bonded thereto at the bonding station, comprising one or more pull-out devices (10) for pulling the substrates off of the support surface of the carriage.