Through-hole contact portion for micro-led and method for forming the same

Abstract

The present disclosure provides a through-hole contact portion for a micro-LED, wherein the through-hole contact portion is configured to electrically connect a first conductive structure with a second conductive structure, wherein the first conductive structure is located below the through-hole contact portion and the second conductive structure is located above the through-hole contact portion, wherein the through-hole contact portion includes: a through-hole formed in an insulating layer and having a hollow cavity; filling metal arranged in the hollow cavity of the through-hole for conducting electricity; and a first metal barrier layer arranged between the bottom of the through-hole and the first conductive structure and/or between the top of the through-hole and the second conductive structure to block diffusion of the filling metal. Furthermore, the present disclosure also provides a method for forming the through-hole contact portion.

Dependencies are inferred from the claim text.