Micro-display chip and method for manufacturing the same and display panel
AssigneeHue Inc.
InventorHuangjian Song
Life of this patent
Estimating the term…
Abstract
Disclosed herein is a micro-display chip including a light-emitting area and a non-light-emitting area, wherein the non-light-emitting area is arranged around the light-emitting area and includes a package layer, wherein the surface of the package layer includes a plurality of rough structures. Etching and roughening the surface of the package layer can reduce its reflectivity, so that the light emitted from the light-emitting area is diffusely reflected after being reflected by the outside and reaching the surface of the package area, which can effectively reduce the re-reflection of full-band light and improve the quality of image display.
Claims18
A micro-display chip, comprising:
- a light-emitting area;
- and
- a non-light-emitting area arranged around the light-emitting area, and the non-light-emitting area comprises a package layer, wherein a surface of the package layer comprises a plurality of rough structures.
A method for manufacturing a micro-display chip, comprising the steps of:
- forming a metal layer on a drive backplane;
- forming at least one micro-LED array and at least one micro-lens array on the surface of the metal layer to form at least one light-emitting area of the micro-display chip, wherein the edge of the at least one micro-LED array does not extend beyond the edge of the metal layer;
- forming a shielding layer or a package layer on the surface of the metal layer not covered by the at least one micro-LED array, wherein in a case that a package layer is formed, the package layer completely covers the surface of the metal layer, and in a case that a shielding layer is formed, the shielding layer covers at least a part of the surface of the metal layer;
- and
- forming a package layer on the surface of the shielding layer and/or the surface of the metal layer not covered by the shielding layer, wherein a surface of the package layer comprises a plurality of rough structures.
Dependencies are inferred from the claim text.