Optoelectronic component and method for producing an optoelectronic component

An optoelectronic component comprising:

• at least one optoelectronic semiconductor chip configured to emit radiation in a first wavelength range;
• at least one optical element;
• and
• an intermediate layer between the at least one optoelectronic semiconductor chip and the at least one optical element,
• wherein the intermediate layer is configured to attach the at least one optoelectronic semiconductor chip to the at least one optical element,
• wherein the at least one optical element comprises a material that is transparent to radiation of a second wavelength range,
• wherein the intermediate layer comprises a material that is transparent to the radiation of the first wavelength range and absorbent to the radiation of the second wavelength range,
• wherein the intermediate layer is free from an organic material, and
• wherein the first wavelength range comprises other wavelengths than the second wavelength range.

A method comprising:

• providing at least one optical element;
• applying an intermediate layer to a main surface of the at least one optical element;
• attaching at least one optoelectronic semiconductor chip to a side of the intermediate layer facing away from the at least one optical element;
• and
• connecting the at least one optical element to the at least one optoelectronic semiconductor chip by irradiating the intermediate layer with radiation of a second wavelength range,
• wherein the at least one optical element comprises a material that is transparent for radiation of the second wavelength range, and
• wherein the radiation of the second wavelength range is absorbed in the intermediate layer so that the intermediate layer is heated at least in places to a temperature above a melting temperature of the intermediate layer.