Light-emitting array substrate, light-emitting array chip and manufacturing method

A light-emitting array chip, comprising:

• a drive backplane;
• and
• a light-emitting array substrate, wherein the light-emitting array substrate is bonded to the drive backplane,
• wherein the light-emitting array substrate comprises:
• a light-emitting diode unit provided with a first conductivity-type electrode on a first side of the light-emitting diode unit and a second conductivity-type electrode on a second side of the light-emitting diode unit, the first conductivity-type electrode and the second conductivity-type electrode having an independent potential connection relationship;
• and
• an electrode unit provided with a second conductivity-type electrode on a first side of the electrode unit, the first side of the light-emitting diode unit and the first side of the electrode unit being on a same side,
• wherein the second conductivity-type electrode of the electrode unit is connected to the second conductivity-type electrode on the second side of the light-emitting diode unit to form a second conductivity-type conductive channel.

A method for manufacturing a light-emitting array substrate, the method comprising:

• providing a substrate, and forming a light-emitting epitaxial layer on the substrate, wherein the light-emitting epitaxial layer has a first side and a second side opposite to the first side, and the second side is a side where the substrate is located;
• etching the light-emitting epitaxial layer at the first side to form a light-emitting diode unit and an electrode unit;
• forming, on the first side, a first conductivity-type electrode on the light-emitting diode unit and a second conductivity-type electrode on the electrode unit;
• removing the substrate;
• forming a first opening on the light-emitting epitaxial layer, the first opening being configured to expose the second conductivity-type electrode of the electrode unit toward the second side of the light-emitting epitaxial layer;
• forming, on the second side, a second conductivity-type electrode on the light-emitting diode unit;
• and
• forming a conductive layer on the second side, the conductive layer being contact-connected to the second conductivity-type electrode of the light-emitting diode unit and to the second conductivity-type electrode of the electrode unit that is exposed through the first opening.