Liquid Cooling Power Conversion System
OwnerQun Luinventor
Life of this patent
Estimating the term…
Abstract
A plurality of power supply units on a power shelf and connected between a power source and an output voltage bus, and a plurality of housings, wherein at least one of the plurality of housings is configured to accommodate a power supply unit, and wherein the at least one of the plurality of housings comprises a first sidewall portion, a second sidewall portion, a bottom case portion and a top case portion, and wherein at least one of the first sidewall portion and the second sidewall portion comprises a channel through which coolant flows to cool heat generation components of the power supply unit.
Claims20
A system comprising:
- a plurality of power supply units on a power shelf and connected between a power source and an output voltage bus;
- and
- a plurality of housings, wherein at least one of the plurality of housings is configured to accommodate a power supply unit, and wherein the at least one of the plurality of housings comprises a first sidewall portion, a second sidewall portion, a bottom case portion and a top case portion, and wherein at least one of the first sidewall portion and the second sidewall portion comprises a channel through which coolant flows to cool heat generation components of the power supply unit.
A system comprising:
- a liquid cooling board comprising a channel through which coolant flows to cool heat generation components of the system;
- a first printed circuit board and a second printed circuit board on opposite sides of the liquid cooling board;
- a plurality of first power modules coupled between the liquid cooling board and the first printed circuit board, wherein each first power module is connected to the liquid cooling board through a first soft thermally conductive layer;
- and
- a plurality of second power modules coupled between the liquid cooling board and the second printed circuit board, wherein each second power module is connected to the liquid cooling board through a second soft thermally conductive layer.
A system comprising:
- a power shelf configured to receive a plurality of power supply units and to provide an output voltage bus;
- a busbar clip configured to electrically couple at least one of the plurality of power supply units to the output voltage bus, wherein the busbar clip is configured to carry a high current;
- and
- a liquid cooling channel disposed in the power shelf, wherein the busbar clip is thermally coupled to the liquid cooling channel such that coolant flowing through the liquid cooling channel absorbs heat generated by the busbar clip during operation.
Dependencies are inferred from the claim text.