Open Bath and Modular Immersion Cooling System for High-Powered Compute Nodes Using Dielectric Fluid

Abstract

The present invention provides a single-phase immersion cooling system for high-powered electronic devices, designed to improve thermal management using a dielectric cooling fluid that remains in its liquid phase throughout operation. The system includes a fully integrated Coolant Distribution Unit (CDU) that delivers the cooling fluid uniformly across the tank floor, ensuring equalized laminar flow and eliminating thermal inconsistencies. An indirect spiraling fluid injection system creates a mixing effect to distribute the cooling fluid evenly while facilitating upward BTU transfer. A modular support structure positions electronic devices above the fluid flow and incorporates a self-sealing design to ensure that 100% of the cooling fluid passes through the devices, maximizing thermal efficiency. The invention also features a modular passive basin for regulating fluid flow, preventing overflow, and providing scalable multi-tank configurations. By utilizing a gravity-based fluid return mechanism, the system lowers the need for powerful expensive pumps or complex plumbing.

Dependencies are inferred from the claim text.