High-density switching embodiments for scale-out fabrics
AssigneeDell Products L.P.
InventorsClaudio DESANTI, Joseph LaSalle WHITE, Macen Kanemi SHINSATO
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AssigneeDell Products L.P.
InventorsClaudio DESANTI, Joseph LaSalle WHITE, Macen Kanemi SHINSATO
Estimating the term…
Presented herein are high-density switching embodiments for networks (e.g., scale-out fabrics) in data centers, particularly for machine learning (ML) and artificial intelligence (AI) applications. Embodiments support improved topologies to optimize network efficiency, reduce latency, and enhance scalability. The present patent document details various configurations, including rail-optimized topologies, interconnect cable systems, and rack designs that support liquid cooling and high-density switching. At least some of the embodiments employ copper cabling for cost-effective interconnections. Embodiments provide efficient data handling and communication in high-computation environments while achieving better performance and reducing infrastructure costs, among other benefits.
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A method for forming a system comprising:
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