Inductor array in a surface mount device

A printed circuit board (PCB), comprising:

• an integrated circuit (IC);
• a surface mount device (SMD) electrically coupled to the IC, the SMD including:
• an enclosure having contacts, the contacts electrically and mechanically coupled to the PCB;
• first and second inductors disposed in the enclosure, the first inductor including a first coil electrically coupled between first and second ones of the contacts, the second inductor including a second coil electrically coupled between third and fourth ones of the contacts;
• the first coil including first conductors disposed on layers in the enclosure, the first conductors being electrically coupled;
• the second coil including second conductors disposed on the layers in the enclosure, the second conductors being electrically coupled;
• wherein each dimension of the first and second contacts is less than a corresponding dimension of the first coil and each dimension of the third and fourth contacts is less than a corresponding dimension of the second coil.

A method of fabricating a surface mount device (SMD), comprising:

• patterning layers to form first and second inductors and contacts, the first inductor including a first coil electrically coupled between first and second ones of the contacts, the second inductor including a second coil electrically coupled between third and fourth ones of the contacts;
• and
• forming an enclosure around the layers, the enclosure exposing the contacts;
• wherein the first coil includes first conductors disposed on layers in the enclosure, the first conductors being electrically coupled, the second coil includes second conductors disposed on the layers in the enclosure, the second conductors being electrically coupled;
• and
• wherein each dimension of the first and second contacts is less than a corresponding dimension of the first coil and each dimension of the third and fourth contacts is less than a corresponding dimension of the second coil.