Three-dimensional microphone array for sound acquisition and sound pickup device
AssigneeYealink (Xiamen) Network Technology Co., Ltd.
InventorsWanjian Feng, Lifeng Lin
Life of this patent
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Abstract
The disclosure provides a three-dimensional microphone array for sound acquisition. The microphone array comprises a plurality of sub-microphone arrays for sound pickup, each comprising a plurality of microphones disposed on the front surface of the substrate; Herein, orthogonal projections of the plurality of microphones of each of the sub-microphone arrays onto a horizontal plane are distributed along a ray, and the ray, on which the orthogonal projections of each of the sub-microphone arrays lie, originates from a center of an orthogonal projection of the substrate onto the horizontal plane and extends to an edge of the substrate; Herein, the front surface of the substrate has a non-planar shape.
Claims20
A three-dimensional microphone array for sound acquisition, the microphone array comprising:
- a substrate having a front surface and a rear surface;
- and
- a plurality of sub-microphone arrays for sound pickup, each comprising a plurality of microphones disposed on the front surface of the substrate;
- wherein orthogonal projections of the plurality of microphones of each of the sub-microphone arrays onto a horizontal plane are distributed along a ray, and the ray, on which the orthogonal projections of each of the sub-microphone arrays lie, originates from a center of an orthogonal projection of the substrate onto the horizontal plane and extends to an edge of the substrate;
- and
- wherein the front surface of the substrate has a non-planar shape.
Dependencies are inferred from the claim text.