Processing Method and Charged Particle Beam Device

A processing method for a sample in which a plurality of layers are stacked, the processing method comprising:

• presetting processing to be performed on a specific layer according to a type or a shape of a defect appearing in the specific layer;
• irradiating the sample with a focused ion beam by a charged particle beam apparatus to expose the layer;
• irradiating the exposed layer with a charged particle beam to generate an observation image of the layer;
• determining whether the specific layer is exposed based on the observation image of the layer;
• when it is determined that there is a defect in the exposed specific layer, specifying a type or a shape of the defect based on an observation image of the sample by using a trained model;
• executing the preset processing in the charged particle beam apparatus according to the specified type or shape of the defect;
• and
• when it is determined that there is no defect in the layer, executing a process recipe for a case where there is no defect, which is prepared separately from the processing for a case where there is the defect, wherein
• the predetermined processing for the case where there is the defect includes at least one of
• elemental analysis based on energy dispersive X-ray fluorescence analysis,
• thinning processing,
• continuous cross-section processing and observation for constructing a three-dimensional model, or
• execution of no process recipe, and
• execution of different processing is enabled for a case where there is a depletion defect, a case where there is a foreign matter defect, and a case where there is no defect.

A charged particle beam apparatus for processing a sample in which a plurality of layers are stacked, the charged particle beam apparatus comprising:

• a focused ion beam lens barrel;
• a charged particle beam lens barrel;
• and
• a processor, wherein
• the processor presets processing to be performed on a specific layer according to a type or a shape of a defect appearing in the specific layer,
• the focused ion beam lens barrel irradiates the sample with a focused ion beam to expose the layer,
• the charged particle beam lens barrel irradiates the exposed layer with a charged particle beam,
• the processor
• generates an observation image of the layer,
• determines whether the specific layer is exposed based on the observation image of the layer, and
• when it is determined that there is a defect in the exposed specific layer, specifies a type or a shape of the defect based on an observation image of the sample by using a trained model,
• the charged particle beam apparatus executes the preset processing according to the specified type or shape of the defect,
• when it is determined that there is no defect in the layer, the processor executes a process recipe for a case where there is no defect, which is prepared separately from the processing for a case where there is the defect,
• the predetermined processing for the case where there is the defect includes at least one of
• elemental analysis based on energy dispersive X-ray fluorescence analysis,
• thinning processing,
• continuous cross-section processing and observation for constructing a three-dimensional model, or
• execution of no process recipe, and
• execution of different processing is enabled for a case where there is a depletion defect, a case where there is a foreign matter defect, and a case where there is no defect.