Microstructure for selective transmission of electromagnetic radiation

A system for manufacturing a microstructure for selective transmission of electromagnetic radiation, the system comprising:

• an optical laser system;
• an etching system;
• a material depositing system;
• and
• a control system comprising one or more controllers, wherein the control system is configured to:
• control the optical laser system to irradiate, with first laser radiation, one or more regions of a substrate according to a predefined geometry of the microstructure to cause a structural modification of a material in the one or more irradiated regions such that, once the substrate is subjected to etching, the etching occurs at a higher rate at the one or more irradiated regions than at a non-irradiated region;
• control the etching system to perform the etching to form a plurality of first openings having the predefined geometry of the microstructure in the substrate;
• control the material depositing system to fill the first openings with at least one radiation opaque material with a desired radiation attenuation spectrum to form a radiation absorbing septa wall structure of the microstructure;
• control the optical laser system and the etching system to, respectively, irradiate, with second laser radiation, one or more non-irradiated regions according to the predefined geometry of the microstructure, and perform etching to form a plurality of second openings between the plurality of first openings, and
• control the material depositing system to not fill the second openings with any radiation opaque material, whereby the second openings are radiation transparent.

A non-transitory computer readable medium comprising executable instructions which, when executed by at least one processor, cause the at least one processor to perform a method for manufacturing a microstructure for selective transmission of electromagnetic radiation, the method comprising:

• irradiating, with first laser radiation, one or more regions of a substrate having two opposite sides according to a predefined geometry of the microstructure to cause a structural modification of a material in the one or more irradiated regions such that, once the substrate is subjected to etching, the etching occurs at a higher rate at the one or more irradiated regions than at a non-irradiated region;
• performing the etching to form a plurality of first openings having the predefined geometry of the microstructure in the substrate;
• filling the first openings with at least one radiation opaque material with a desired radiation attenuation spectrum to form a radiation absorbing septa wall structure of the microstructure;
• and
• irradiating, with second laser radiation, one or more non-irradiated regions according to the predefined geometry of the microstructure, and performing etching to form a plurality of second openings, distinct from the first openings, between the plurality of first openings, wherein the second openings are not filled with any radiation opaque material, whereby the second openings are radiation transparent, and wherein the second openings and the first openings are formed on one same side of the substrate.