Hybrid plasmonic electro-optic modulators
AssigneeGlobalFoundries U.S. Inc.
InventorsAvijit Chatterjee, Aneesh Dash, Pratyasha Priyadarshini
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Abstract
Structures for a photonic chip that include a modulator and methods of forming such structures. The structure comprises a first waveguide core, a second waveguide core that overlies the first waveguide core, and a first layer between the first waveguide core and the second waveguide core. The structure further comprises a second layer adjacent to the first layer, and a third layer adjacent to the first layer. The first layer is positioned in a lateral direction between the second layer and the third layer, the first layer comprises an electro-optic material, and the second and third layers comprise a metal.
Claims20
A structure for a photonic chip, the structure comprising:
- a first waveguide core;
- a second waveguide core that overlies the first waveguide core;
- a first layer between the first waveguide core and the second waveguide core, the first layer comprising an electro-optic material;
- a second layer adjacent to the first layer;
- and
- a third layer adjacent to the first layer,
- wherein the first layer is positioned in a lateral direction between the second layer and the third layer, and the second layer and the third layer comprise a metal.
A method of forming a structure for a photonic chip, the method comprising:
- forming a first waveguide core;
- forming a first layer comprising an electro-optic material;
- forming a second waveguide core that overlies the first waveguide core, wherein the first layer is positioned between the first waveguide core and the second waveguide core;
- forming a second layer adjacent to the first layer;
- and
- forming a third layer adjacent to the first layer,
- wherein the first layer is positioned in a lateral direction between the second layer and the third layer, and the second layer and the third layer comprise a metal.
Dependencies are inferred from the claim text.