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AssigneeTeknologian tutkimuskeskus VTT Oy
InventorsJanne LEHTINEN, Aapo VARPULA, Mika PRUNNILA
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A probing device comprising at least one tip portion configured to probe a sample, wherein the probing device is provided with a heat transfer arrangement, optionally provided in connection with the tip portion or as part of the tip portion, wherein said heat transfer arrangement is configured to cool or heat at least a portion of the probing device and comprises at least a first material portion and a second material portion, said material portions comprising at least one superconducting material portion and at least one other material portion comprising an insulating material portion, normal metal material or semiconductor material portion, wherein the material portions are arranged to form at least one tunnel junction comprising at least one superconductor-insulator-normal metal (SIN) junction, superconductor-insulator-semiconductor (SISm) junction, or superconductor-semiconductor junction (SSm). A method of manufacturing a probing device and a method for probing a sample.
A probing device comprising at least one tip portion configured to probe a sample, wherein the probing device is provided with a heat transfer arrangement, optionally provided in connection with the tip portion or as part of the tip portion, wherein said heat transfer arrangement is configured to cool or heat at least a portion of the probing device and comprises at least a first material portion and a second material portion, said material portions comprising at least one superconducting material portion and at least one other material portion comprising an insulating material portion, normal metal material or semiconductor material portion, wherein the material portions are arranged to form at least one tunnel junction comprising at least one superconductor-insulator-normal metal (SIN) junction, superconductor-insulator-semiconductor (SISm) junction, or superconductor-semiconductor junction (SSm).
A method of manufacturing a probing device, the method comprising providing a probing device with at least one tip portion, providing a heat transfer arrangement, optionally in connection to or as part of the tip portion, and configuring said heat transfer arrangement to cool or heat at least a portion of the probing device by providing the heat transfer arrangement through providing at least a first material portion and providing a second material portion, said material portions comprising at least one superconducting material portion and at least one other material portion comprising an insulating material portion, normal metal material or semiconductor material portion, and arranging the material portions to form at least one tunnel junction comprising at least one superconductor-insulator-normal metal (SIN) junction, superconductor-insulator-semiconductor (SISm) junction, or superconductor-semiconductor junction (SSm).
Dependencies are inferred from the claim text.