Substrate processing apparatus, method of processing substrate, method of manufacturing semiconductor device, and recording medium

A method of processing a substrate, comprising:

• providing the substrate loaded via a first loading port installed at a front surface side of a first process module to a first process container which is configured to process the substrate and included in the first process module;
• providing the substrate loaded via a second loading port installed at a front surface side of a second process module to a second process container which is configured to process the substrate and included in the second process module disposed adjacent to a side surface of the first process module;
• supplying a process gas into the first process container from a first supply system, which is included in a first utility disposed adjacent to a rear surface of the first process module;
• supplying the process gas into the second process container from a second supply system, which is included in a second utility disposed adjacent to a rear surface of the second process module;
• and
• performing maintenance of a part of the first supply system through access from at least one selected from the group of a front side, a rear side, and a top side of a first side box, not through access from a side surface of the first side box, the first side box protruding farther outward than a first outer side surface of the first process module that is parallel in a front-rear direction and accommodating the part of the first supply system.

A non-transitory computer-readable recording medium storing a program that causes a computer included in a substrate processing apparatus to perform:

• providing a substrate loaded via a first loading port installed at a front surface side of a first process module to a first process container which is configured to process the substrate and included in the first process module;
• providing a substrate loaded via a second loading port installed at a front surface side of a second process module to a second process container, which is configured to process the substrate and included in the second process module disposed adjacent to a side surface of the first process module;
• supplying a process gas into the first process container from a first supply system, which is included in a first utility disposed adjacent to a rear surface of the first process module;
• supplying the process gas into the second process container from a second supply system, which is included in a second utility disposed adjacent to a rear surface of the second process module;
• and
• performing maintenance of a part of the first supply system through access from at least one selected from the group of a front side, a rear side, and a top side of a first side box, not through access from a side surface of the first side box, the first side box protruding farther outward than a first outer side surface of the first process module that is parallel in a front-rear direction and accommodating the part of the first supply system.