Curable composition and thermally conductive member
AssigneeSekisui Chemical Co., Ltd.
InventorsAtsushi FURUKAWA, Tatsuya IWAMOTO, Yusuke KOBAYASHI, Tetsuro YOSHIOKA
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Abstract
A curable composition comprising an epoxy resin, a thermally conductive filler, an amine compound (X) having two or more amino groups, and a polyfunctional acrylate compound, the amine compound (X) having a viscosity of 20 Pa·s or less measured at 25° C. and 10 rpm using an E-type viscometer or having an oxyalkylene structure, a content of the amine compound (X) with respect to a total amount of resin components being 15 mass % or more and 55 mass % or less.
Claims25
A curable composition comprising an epoxy resin, a thermally conductive filler, an amine compound (X) having two or more amino groups, and a polyfunctional acrylate compound,
- the amine compound (X) having a viscosity of 20 Pas or less measured at 25° C. and 10 rpm using an E-type viscometer or having an oxyalkylene structure,
- a content of the amine compound (X) with respect to a total amount of resin components being 30 mass % or more and 55 mass % or less.
A curable composition comprising an epoxy resin, a thermally conductive filler, an amine compound (X) having two or more amino groups, a polyfunctional acrylate compound, and water,
- a content of the water with respect to a total amount of the curable composition being 0.3 mass % or more and 2.0 mass % or less,
- wherein a content of the amine compound (X) with respect to a total amount of resin components is 30 mass % or more.
A curable composition comprising an epoxy resin, a thermally conductive filler, an amine compound (X) having two or more amino groups, and a polyfunctional acrylate compound,
- the amine compound (X) having a viscosity of 20 Pa·s or less measured at 25° C. and 10 rpm using an E-type viscometer or having an oxyalkylene structure,
- a content of the amine compound (X) with respect to a total amount of resin components being 35 mass % or more and 70 mass % or less,
- the amine compound (X) comprising an amine compound having two amino groups.
A curable composition comprising an epoxy resin, a thermally conductive filler, an amine compound (X) having two or more amino groups, and a polyfunctional acrylate compound,
- the amine compound (X) having a viscosity of 20 Pa·s or less measured at 25° C. and 10 rpm using an E-type viscometer or having an oxyalkylene structure,
- a content of the amine compound (X) with respect to a total amount of resin components being 15 mass % or more and 55 mass % or less,
- the composition being cured by leaving the composition at room temperature.
Dependencies are inferred from the claim text.