Thermally conductive silicone composition and method for producing thermally conductive silicone composition

A thermally conductive silicone composition, comprising:

• a component (A), wherein the component (A) is an alkenyl group-containing diorganopolysiloxane, having a viscosity of 500 mPa·s or more and 7,000 mPa·s or less at 25° C., in an amount of 1.0 part by mass or more and 9.0 parts by mass or less;
• a component (B), wherein the component (B) is an organopolysiloxane, having a viscosity of 10,000 mPa·s or more and 200,000 mPa·s or less at 25° C., in an amount of 0.05 parts by mass or more and 1.0 part by mass or less;
• a component (C), wherein the component (C) is an organopolysiloxane having two or more hydrosilyl groups within one molecule;
• a component (D), wherein the component (D) is a diorganopolysiloxane having no alkenyl group, having a viscosity of 500 mPa·s or less at 25° C.;
• a component (E), wherein the component (E) is an addition reaction catalyst;
• a component (F), wherein the component (F) is at least one or two or more thermally conductive fillers selected from the group consisting of a metal, a metal oxide, a metal hydroxide, a metal nitride, and a metal carbide, wherein the component (F) is present in an amount of 85 parts by mass or more relative to 100 parts by mass of the entire thermally conductive silicone composition;
• wherein the thermally conductive silicone composition has a mixing viscosity of 250 Pa·s or less at 25° C.;
• and
• wherein the organopolysiloxane of the component (C) is different from the components (A), (B), and (D).

A method for producing a thermally conductive silicone composition, comprising:

• providing a first liquid production step of mixing a component (A) that is an alkenyl group-containing diorganopolysiloxane, having a viscosity of 500 mPa·s or more and 7,000 mPa·s or less at 25° C., in an amount of 1.0 part by mass or more and 9.0 parts by mass or less, a component (B) that is an organopolysiloxane, having a viscosity of 10,000 mPa·s or more and 200,000 mPa·s or less at 25° C., in an amount of 0.05 parts by mass or more and 1.0 part by mass or less, a component (D) that is a non-functional diorganopolysiloxane having no alkenyl group, having a viscosity of 500 mPa·s or less at 25° C., and a component (E) that is an addition reaction catalyst, and then mixing a component (F) that is at least one or two or more thermally conductive fillers selected from the group consisting of a metal, a metal oxide, a metal hydroxide, a metal nitride, and a metal carbide, to obtain a first liquid;
• providing a second liquid production step of mixing the component (B) that is an organopolysiloxane, having a viscosity of 10,000 mPa·s or more and 200,000 mPa·s or less at 25° C., in an amount of 0.05 parts by mass or more and 1.0 part by mass or less, a component (C) that is an organopolysiloxane having two or more hydrosilyl groups within one molecule, the component (D) that is a non-functional diorganopolysiloxane having no alkenyl group, having a viscosity of 500 mPa·s or less at 25° C., and the component (F) that is at least one or two or more thermally conductive fillers selected from the group consisting of a metal, a metal oxide, a metal hydroxide, a metal nitride, and a metal carbide, to obtain a second liquid;
• and
• wherein the organopolysiloxane of the component (C) is different from the components (A), (B), and (D).

A method for producing a thermally conductive member, comprising:

• providing a thermally conductive silicone composition comprising a component (A), a component (B), a component (C), a component (D), a component (E) and a component (F),
• wherein the component (A) is an alkenyl group-containing diorganopolysiloxane, having a viscosity of 500 mPa·s or more and 7,000 mPa·s or less at 25° C., in an amount of 1.0 part by mass or more and 9.0 parts by mass or less,
• wherein the component (B) is an organopolysiloxane, having a viscosity of 10,000 mPa·s or more and 200,000 mPa·s or less at 25° C., in an amount of 0.05 parts by mass or more and 1.0 part by mass or less,
• wherein the component (C) is an organopolysiloxane having two or more hydrosilyl groups within one molecule,
• wherein the component (D) is a diorganopolysiloxane having no alkenyl group, having a viscosity of 500 mPa·s or less at 25° C.,
• wherein the component (E) is an addition reaction catalyst,
• wherein the component (F) is at least one or two or more thermally conductive fillers selected from the group consisting of a metal, a metal oxide, a metal hydroxide, a metal nitride, and a metal carbide, wherein the component (F) is present in an amount of 85 parts by mass or more relative to 100 parts by mass of the entire thermally conductive silicone composition,
• wherein the thermally conductive silicone composition has a mixing viscosity of 250 Pa·s or less at 25° C.,
• wherein the organopolysiloxane of the component (C) is different from the components (A), (B), and (D),
• wherein the thermally conductive silicone composition is a two-component thermally conductive silicone composition including a first liquid and a second liquid separated from each other, the first liquid and the second liquid being mixed when used,
• wherein the first liquid contains the components (A), (B), (D), (E) and (F), and
• wherein the second liquid contains the components (B), (C), (D), and (F), but not the component (E);
• discharging the first liquid from a first liquid storage unit to a mixing unit;
• discharging the second liquid from a second liquid storage unit to the mixing unit;
• mixing the first liquid and the second liquid in the mixing unit to obtain a thermally conductive silicone composition;
• discharging and applying the thermally conductive silicone composition onto a substrate;
• and
• curing the thermally conductive silicone composition applied onto the substrate to obtain a thermally conductive member.

A method for producing a heat-dissipating member, comprising:

• providing a thermally conductive silicone composition comprising a component (A), a component (B), a component (C), a component (D), a component (E) and a component (F),
• wherein the component (A) is an alkenyl group-containing diorganopolysiloxane, having a viscosity of 500 mPa·s or more and 7,000 mPa·s or less at 25° C., in an amount of 1.0 part by mass or more and 9.0 parts by mass or less,
• wherein the component (B) is an organopolysiloxane, having a viscosity of 10,000 mPa·s or more and 200,000 mPa·s or less at 25° C., in an amount of 0.05 parts by mass or more and 1.0 part by mass or less,
• wherein the component (C) is an organopolysiloxane having two or more hydrosilyl groups within one molecule,
• wherein the component (D) is a diorganopolysiloxane having no alkenyl group, having a viscosity of 500 mPa·s or less at 25° C.,
• wherein the component (E) is an addition reaction catalyst,
• wherein the component (F) is at least one or two or more thermally conductive fillers selected from the group consisting of a metal, a metal oxide, a metal hydroxide, a metal nitride, and a metal carbide, wherein the component (F) is present in an amount of 85 parts by mass or more relative to 100 parts by mass of the entire thermally conductive silicone composition,
• wherein the thermally conductive silicone composition has a mixing viscosity of 250 Pa·s or less at 25° C.,
• wherein the organopolysiloxane of the component (C) is different from the components (A), (B), and (D);
• providing a substrate and a thermally conductive member disposed on a surface of the substrate, the thermally conductive member being any of thermally conductive members including a thermally conductive member obtained by curing the thermally conductive silicone composition;
• obtaining a thermally conductive member by curing the thermally conductive silicone composition, wherein the thermally conductive silicone composition is obtained by providing a first liquid production step of mixing a component (A) that is an alkenyl group-containing diorganopolysiloxane, having a viscosity of 500 mPa·s or more and 7,000 mPa·s or less at 25° C., in an amount of 1.0 part by mass or more and 9.0 parts by mass or less, a component (B) that is an organopolysiloxane, having a viscosity of 10,000 mPa·s or more and 200,000 mPa·s or less at 25° C., in an amount of 0.05 parts by mass or more and 1.0 part by mass or less, a component (D) that is a non-functional diorganopolysiloxane having no alkenyl group, having a viscosity of 500 mPa·s or less at 25° C., and a component (E) that is an addition reaction catalyst, and then mixing a component (F) that is at least one or two or more thermally conductive fillers selected from the group consisting of a metal, a metal oxide, a metal hydroxide, a metal nitride, and a metal carbide, to obtain a first liquid,
• providing a second liquid production step of mixing the component (B) that is an organopolysiloxane, having a viscosity of 10,000 mPa·s or more and 200,000 mPa·s or less at 25° C., in an amount of 0.05 parts by mass or more and 1.0 part by mass or less, a component (C) that is an organopolysiloxane having two or more hydrosilyl groups within one molecule, the component (D) that is a non-functional diorganopolysiloxane having no alkenyl group, having a viscosity of 500 mPa·s or less at 25° C., and the component (F) that is at least one or two or more thermally conductive fillers selected from the group consisting of a metal, a metal oxide, a metal hydroxide, a metal nitride, and a metal carbide, to obtain a second liquid, and
• wherein the organopolysiloxane of the component (C) is different from the components (A), (B), and (D);
• and
• obtaining a thermally conductive member, wherein the thermally conductive member is obtained by obtaining thermally conductive silicone composition, wherein the thermally conductive silicone composition is a two-component thermally conductive silicone composition including a first liquid and a second liquid separated from each other, the first liquid and the second liquid being mixed when used, wherein the first liquid contains the components (A), (B), (D), (E) and (F), and wherein the second liquid contains the components (B), (C), (D), and (F), but not the component (E), wherein the first liquid is discharged from a first liquid storage unit to a mixing unit, herein the second liquid is discharged from a second liquid storage unit to the mixing unit, wherein the first liquid and the second liquid are mixed together in the mixing unit to obtain a thermally conductive silicone composition, wherein the thermally conductive silicone composition is discharged and applied onto a substrate, and wherein the thermally conductive silicone composition is cured and applied onto the substrate to obtain a thermally conductive member.