Non-curable thermal grease with boron nitride
AssigneesDow Silicones Corporation, Dow Global Technologies LLC
InventorsZhanjie LI, Dorab Bhagwagar, Ryan Maar, Danielle Berry, Peng Wei
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Abstract
The present invention relates to a non-curable thermal grease comprising filler particles, boron nitride platelet particles, and a trialkoxysilyl-terminated polydimethylsiloxane. The non-curable thermal grease is useful as a thermal interface material in microelectronic devices to transport heat generated by a heat source to a heat sink.
Claims13
A non-curable thermal grease composition comprising, based on the weight of the composition, a) from 80 to 95 weight percent of one or more filler particles selected from the group consisting of aluminum, alumina, and zinc oxide;
- b) from 0.2 to 8 weight percent platelet boron nitride particles;
- and c) 0.2 to 10 weight percent of a trialkoxylated polydimethylsiloxane of structure 1:
- where R and R1 are each independently C1-C6-alkyl, Y is O or CH2—CH2;
- and x is from 30 to 200;
- wherein the non-curable thermal grease composition optionally comprises d) up to 10 weight percent of a polydimethylsiloxane or poly(phenylmethylsiloxane-dimethylsiloxane) carrier fluid having a viscosity in the range of from 30 to 200 cSt.
Dependencies are inferred from the claim text.