US 2026/0218024 A1Published application

Adhesive composition, laminate, and method for producing processed semiconductor substrate

AssigneeNissan Chemical Corporation

InventorsTakahisa OKUNO, Masaki YANAI, Yuki USUI, Tetsuya SHINJO

Life of this patent

Estimating the term…

An adhesive composition containing two or more release agent components.

Dependent claims

An adhesive composition comprising:

Dependencies are inferred from the claim text.

C09J 183/06
Polysiloxanes: containing silicon bound to oxygen-containing groups
B32B 7/12
Interconnection of layers: using interposed adhesives or interposed materials with bonding properties
B32B 9/04
Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00: comprising such particular substance as…
B32B 43/006
Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor: delaminating

No related US applications are recorded in the indexed filing history.

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