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US 2026/0218023 A1Published application
Adhesive composition, laminate, and method for producing processed semiconductor substrate
AssigneeNissan Chemical Corporation
InventorsYuki USUI, Takahisa OKUNO, Masaki YANAI, Tetsuya SHINJO
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Abstract
An adhesive composition cured by a hydrosilylation reaction, containing a platinum group metal-based catalyst and a compound represented by Formula (1) below, where R1 and R2 each independently represents a monovalent group.
Claims9
An adhesive composition cured by a hydrosilylation reaction, containing
- a platinum group metal-based catalyst and a compound represented by Formula (1) below:
- wherein in Formula (1), R1 and R2 each independently represent a monovalent group.
Dependencies are inferred from the claim text.