Back to results
US 2026/0218014 A1Published application
Self-adhering insulation or cover board
AssigneeSika Technology AG
InventorsMichael DARSCH, Albert J. Duhamel, Kristen Glasheen, Laurie Hill, Blaise W. Leeber, Ajay Padwal
Life of this patent
Estimating the term…
Abstract
An insulation or cover board includes a substrate layer having upper and lower primary exterior surfaces and an adhesive layer covering at least a portion of one of the primary exterior surfaces of the substrate layer, wherein the adhesive layer is formed of a non-reactive hot-melt pressure sensitive adhesive.
Claims18
An insulation or cover board comprising:
- i. a substrate layer having upper and lower primary exterior surfaces,
- ii. an adhesive layer covering at least a portion of one of the primary exterior surfaces of the substrate layer, and
- iii. optionally a release liner,
- wherein the adhesive layer is formed of a non-reactive hot-melt pressure sensitive adhesive.
1 more element
Dependencies are inferred from the claim text.