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US 2026/0218003 A1Published application
Resin composition for encapsulating electronic device and electronic device manufactured using same
AssigneeDongwoo Fine-Chem Co., Ltd.
InventorsYU MI AHN, JEONG MIN KANG, SU SEONG KIM, SEONG HWAN PARK, DONG CHAN LEE
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Abstract
A resin composition for encapsulating an electronic device includes an epoxy-base compound containing a biphenyl-based epoxy compound, and an inorganic filler comprising first alumina particles surface-treated with a silane agent including an alkyl group of a carbon number of 7 or higher, and second alumina particles that have been not treated with silane. The amount of first alumina particles is 4-35 wt % on the basis of the total weight of the composition.
Claims15
A resin composition for sealing an electronic device, comprising:
- an epoxy-based compound including a biphenyl-based epoxy compound;
- and
- an inorganic filler including:
- first alumina particles surface-treated with a silane agent, the silane agent including an alkyl group having 7 or more carbon atoms;
- and
- second alumina particles that are not silane-treated,
- wherein a content of the first alumina particles is in a range from 2.5 wt % to 35 wt % based on a total weight of the resin composition.
4 more elements
Dependencies are inferred from the claim text.